• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method of manufacturing smart cards. According to this method, an antenna and a smart card module (400) are provided. This smart card module (400) comprises a dielectric substrate and conductive tracks only on one side of this substrate. A connection unit (300) is used to establish a connection between the antenna and conductive tracks of the module (400). The invention also relates to a method of manufacturing an antenna support comprising such a connection unit (300). The invention also relates to a smart card and an antenna support obtained by the aforementioned methods.
    公开号:FR3049739A1
    申请号:FR1652762
    申请日:2016-03-30
    公开日:2017-10-06
    发明作者:Cyril Proye；Valerie Mousque
    申请人:Linxens Holding SAS；
    IPC主号:
    专利说明:

    FIELD OF THE INVENTION The invention relates to the field of smart cards and smart card antenna supports. Smart cards are well known to the public, which has multiple uses: payment cards, SIM cards for mobile phones, transport cards, identity cards, etc.
    The smart cards comprise transmission means for transmitting data from an electronic chip (integrated circuit) to a card reader device (reading) or from this device to the card (writing). These transmission means can be "contact", "non-contact" or double-interface when they combine the two previous means. The invention makes it possible to produce, in particular, double-interface smart cards. Dual-interface smart cards are called "dual" if the "contact" and "contactless" modes are managed by a single chip or "hybrid" if the "contact" and "contactless" modes are managed by two physically distinct chips.
    The dual-interface smart cards generally consist of a rigid plastic support type PVC, PVC / ABS, PET or polycarbonate constituting the main part of the card, in which are incorporated an electronic module and an antenna. The electronic module comprises a generally flexible printed circuit board equipped with an electronic chip and contact pads electrically connected to the chip and flush with the electronic module, on the surface of the support constituting the card, for connection by electrical contact with a device. card reader. The dual interface smart cards further include at least one antenna for transmitting data between a chip and a radiofrequency system for reading or writing data, without contact.
    In the prior art, the electronic module comprising the contacts and the chip, on the one hand, and the antenna possibly integrated with a support ("inlay" according to the English terminology), on the other hand, are generally manufactured separately, then the antenna is connected to the module on which is mounted and connected the chip. The connection between the antenna and the module is carried out according to complex processes that negatively impact the productivity, the manufacturing yields and the reliability of the cards during their use.
    An object of the invention is to simplify this type of process and to make reliable the connection between the antenna and the module.
    This goal is at least partly achieved by a method of manufacturing a smart card comprising: - the realization of an antenna; the antenna having at least two ends and being for electromagnetic coupling with a non-contact card reading device; the lamination of at least two layers of plastic material between which the antenna is placed; placing, in a cavity formed in at least one layer of plastic material, a chip card module comprising a substrate; this substrate having first and second main faces, and conductive tracks being disposed only on the first main face of the substrate. For example, at least one of these conductive tracks is dedicated to an electrical connection with a card reader device, and at least one other of these conductive tracks is dedicated to a connection with the antenna.
    This method furthermore comprises the provision of a connection unit comprising a flexible film with a conductive layer on one of its main faces, this conductive layer comprising at least one connection pad which itself comprises a first and a second portions, electrically connected together, - the connection of one end of the antenna to a first portion of the conductive layer of the connection pad, and - the connection of a conductive trace of the module located on the first face of the substrate of the module, to a second portion of the conductive layer of the connection pad.
    For example, the connection unit is placed with the antenna, on or in a structure ("inlay" according to the English terminology) between two plastic layers, before lamination thereof. The use of a connection unit has many advantages. The connection unit is manufactured independently of the antenna and the module. It can be used in any method of embedding antenna and module. It makes it easy to design and build modules with six or eight contact pads. It is compatible with many antenna formats including the ID1 and 1 / 2ID1 formats. It allows a reliable connection between the antenna and the module, thanks to the connection pads which offer specifically dedicated portions for the connection, respectively of the antenna and the module (possibly the dimensions of these portions are adapted to the type of connection: thermocompression, ultrasound, welding, etc.). It is compatible with both wired antennas and engraved antennas.
    The process according to the invention optionally comprises one or the other of the following characteristics, considered separately or in combination with one or more others: a welding material is deposited on the second portion of the conductive layer of a stud; connection, to connect one end of the antenna to the module; the deposition of a solder material or solder (for example consisting of a tin-bismuth alloy), for example in the form of drops, on the connection pads allows, once the connection unit integrated into a support antenna to produce a product ("inlay" with an antenna) that can be marketed as is to be embedded in layers of plastic and connected to a module mounted in the card later; this product is ready for use and facilitates the operations of the card manufacturer; indeed, the card manufacturer has only to assemble elements ("inlay" with an antenna, module and plastic sheets) optionally provided separately; the operation of connecting the module to the antenna is extremely simplified by the use of the solder material already in place on the connection pads; in addition, this operation can be concomitant with that of fixing or gluing the module in its cavity, either only with the welding material itself, or with the aid of a bonding material such as a thermo-reactive adhesive, a single heating operation then being necessary to both connect the module to the antenna and fix the module in its cavity; thus, once the module is in place in the cavity, the solder material deposited on the second portion of the conductive layer of the connection pad is heated in order to weld a conductive track of the module dedicated to an antenna connection, with a connection pad; to facilitate, and possibly make reliable, the connection between the antenna and the module, the solder material deposited on a connection pad of the antenna exceeds, before its heating, the surface of a cavity made, for example by milling, in some of the layers of plastics; the solder material consists of a material having a melting temperature of between 120 ° C. and 230 ° C., and more preferably between 130 ° C. and 150 ° C .; the heating of the solder material is carried out by applying to a zone of the module, for example by means of a thermode, a temperature of between 120 ° C. and 250 ° C .; - The deposition of the solder material on the second portion of the conductive layer is achieved by a technique selected from dispensing, screen printing and technology called "wave" ("wave soldering" in the English terminology); the antenna is made on an antenna support, for example by embedding the antenna in a plastic antenna support; or the antenna is etched in a layer of co-laminated conductive material with an antenna support of dielectric material; or the antenna is made independently of its support before being transferred to it; the antenna support, together with the antenna, is laminated with the connection unit and at least one plastic layer, to directly form a structure corresponding to the smart card or to form an intermediate structure ("Inlay"). ) which is inserted later; - The connection unit is made on a flexible film independent and possibly different in nature, the antenna support; the antenna support comprises a PVC substrate; the layer or layers of plastic material laminated with the antenna support and the connection unit are made of PVC; in the openings in the substrate of the module, a solder alloy is deposited on the conductive tracks dedicated to the connection with the antenna facing the second portions of the conductive layer of the connection unit; thus, there is solder material on both the connection unit and the module; - The connection unit is arranged in a cutout in at least one layer of plastic material.
    The method according to the invention can be implemented continuously ("real-to-real" according to the English terminology).
    According to another aspect the invention is a smart card, for example made by the method mentioned above, comprising an antenna and a smart card module. The antenna is for electromagnetic coupling with a non-contact card reading device. The antenna has at least two ends. The antenna is located between layers of plastic laminated together.
    The module itself comprises a substrate having a first and a second main face, with at least two conductive tracks on the first face of this substrate. For example, one of these two conductive tracks is dedicated to an electrical connection with a contact card reading device (in other words, this track is connected, by one of its faces, electrically and permanently to a electronic chip and, by the other of its faces, possibly temporarily, to a contact card reading device, when the card is inserted into this device). The other of these two tracks can be dedicated only to an indirect connection with an antenna (in other words this other track is electrically connected on the one hand to a chip, and on the other hand, indirectly to an antenna). The second main face of the module is devoid of conductive tracks. The module is housed in a cavity formed in at least some of the plastic layers.
    In addition, this smart card comprises a connection unit comprising a flexible film with a conductive layer on one of its main faces. This conductive layer comprises at least one connection pad having itself a first and a second portion, electrically connected to each other. On the one hand, one end of the antenna is electrically connected to a first portion of the conductive layer of the connection pad. On the other hand, a conductive track of the module, located on the first face of the substrate, is electrically connected to a second portion of the conductive layer of the connection pad.
    This smart card optionally comprises a connection unit with two connection pads, each having a first and a second portion, electrically connected respectively, on the one hand, to one end of the antenna and, on the other hand, to a conducting track of the module located on the first face of the substrate.
    In another aspect, the invention is an antenna support for a smart card. This chip card antenna support includes an antenna for electromagnetic coupling with a non-contact card reader. The antenna has at least two ends. This support further comprises a connection unit comprising a flexible film and a conductive layer on one of the main faces of the flexible film. This conductive layer comprises at least one connection pad having a first and a second portion, electrically connected to each other. The first portion is electrically connected to one end of the antenna. A solder material is deposited on the second portion of the conductive layer, with a thickness adapted to establish an electrical connection with a conductive track located on a first major face of a chip card module substrate, when the module is positioned in a cavity of the smart card, with its second main face, devoid of conductive tracks, facing the connection unit (this chip card module substrate having, in fact, a first and a second main faces).
    This antenna support optionally comprises one or the other of the following characteristics, considered separately or in combination with one or more others: the welding material deposited on the second portion of the conductive layer of the connection unit has a thickness of between 0.02 and 0.5 mm; it comprises several layers of plastic material laminated together and a connection unit is disposed in a cavity or cutout formed in at least one of the layers of plastics material; the solder material consists of an alloy having a lower reflow temperature equal to or close to 200 ° C .; for example it is an alloy of tin or indium; more particularly, it may be an alloy included in the list composed of tin-bismuth alloys, alloys of tin, bismuth and silver (SnBiAg), alloys of tin, bismuth and nickel (SnBiNi), indium and bismuth alloys (InBi); it comprises a PVC substrate.
    According to yet another aspect, the invention is a method of manufacturing such an antenna support in which a connection unit is laminated with a plastic layer on which an antenna rests. Other features and advantages of the invention will appear on reading the detailed description and the accompanying drawings in which: - Figure 1 shows schematically in perspective a smart card according to the invention; FIG. 2 represents, schematically and exploded, an example of a stack of constituent layers of the smart card represented in FIG. 1; - Figure 3 shows schematically, in section and in an enlarged manner, a portion of the stack shown in Figure 2; - Figure 4 shows schematically connection units, at different stages of their manufacture, forming part of the stack shown in Figures 2 and 3; - Figure 5 shows schematically in perspective a step of the chip card manufacturing method according to the invention; - Figure 6 shows schematically in perspective another step of the chip card manufacturing method according to the invention.
    According to an embodiment of a smart card 1 shown in FIG. 1, the latter comprises a module 400 and a multilayer complex 200.
    The multilayer complex 200 consists, for example, of different plastic layers, such as (from bottom to top in FIG. 2): a lower layer 205, an antenna support 210, and an upper layer 220.
    The lower layer 205 is for example a topcoat (printing for example) and protection of the card 1. It is located under an antenna support 210. The thickness of this lower layer 205 PVC is for example 0.20 mm thick before lamination and 0.18 mm thick after lamination. This lower layer 205 is of uniform thickness and has no cutout intended to form a cavity for receiving a module.
    The antenna support 210 comprises a PVC substrate 212 of 0.43 mm thick before lamination and 0.40 mm thick after lamination. A wire antenna 214 for example is deposited and fixed to the substrate 212 (for example embedded, by the so-called technique of "wire embedding"). This antenna is formed of several coiled turns and ends with two ends 216, 218.
    Note that the antenna support 210 may be composed of at least two sublayers 21 OA, 201 B. In this case, the antenna is inserted for example between the bottom layer 21 OA and the top layer 21OB and the top layer has a cut-out for receiving a connection unit 300. The connection unit 300 comprises a flexible film 310 with first and second main faces (see also Fig. 3). A conductive layer 312 is colaminated on one of these main faces. The substrate 310 is for example made of FR4 or VEP type material (glass-epoxy), 0.075 mm thick (and more generally less than or equal to 0.1 mm) The conductive layer 312 is for example made of an alloy of The flexible film 310 is therefore, for example, of the copper clad type ("copper clad" in the English terminology), for example, the connection unit 300 has a length of 0.03 mm. 18 mm and a width of 4.5 mm An opening 314 of 8 mm by 4 mm, for example, is cut substantially in the middle of the connection unit 300. The connection unit 300 comprises two connection pads 316 Each connection pad 316 comprises a first 317 and a second 319 electrically connected portions (see also FIG. 4) The first portion 317 has a substantially rectangular shape The second portion 319 has a U-shape extending around it openings 302, with c the bottom of the U connected (connected) essentially in the middle of the first portion 317 considered in its longitudinal direction. According to another example not shown, each connection pad has an "H" shape with each of the parallel branches of the "H" respectively corresponding to a first or a second portion of the metallized zone, these first and second portions being connected by the middle branch.
    As shown in FIG. 4, connection units 300 are made (for example continuously, from coil to coil), from a flexible film 310. This flexible film 310 is cut (for example by punching) to form openings 302 for receiving the encapsulation resin of a module 400, as explained below. Training notches are also cut. The conductive layer is then etched (for example by photolithography techniques) to form the connection pads 316 (two connection pads 316 per connection unit 300), with its first 317 and second 319 portions.
    Solder material 350 is then deposited on each of the first 317 and second 319 portions of the connection pads 316 "for example to a thickness of, for example, between 0.02 and 0.5 mm. The solder material 350 is then removed from the first portions 317. Finally the connection units 300 are cut to be individualized. Alternatively, the solder material 350 is deposited more selectively, for example in the form of solder drop, only on each of the second portions 319 of the connection pads 316. The deposition of the solder material 350 on the second 319 portions ( but as indicated above possibly also on the first 317 portions) of the conductive layer connecting pads 316 is made for example by dispensing, screen printing or technology called "wave" (this technology allows to deposit material welding 350 on thicknesses of the order of 100 or 200pm or less, and on small surfaces, such as 3x4 mm2). Each drop of solder material 350, once deposited on a second portion 319 and before the heating operation to effect the soldering between the connection unit 300 and the module 400, forms a dome having a height of between 0.02. and 0.5 mm. Advantageously, as can be seen in FIG. 3, each drop of welding material 350, before heating, protrudes from the surface of the cavity 410. In fact, each drop of welding material 350, during heating, must come in contact with the conductive tracks 416. The wettability of the melted solder material 350 may be sufficient to establish the connection, even in cases where a drop of weld material 350 would only be flush with the surface of the cavity 410 on which the module 400 is housed. However, it is possible to avoid insufficient or faulty contact due to insufficient wettability by adjusting the height of each drop of solder material 350 so that this height is greater than at least the thickness of the antenna support 210 .
    Returning to the description of the stack of plastic layers, in connection with Figures 2 and 3, the top layer 220 of finishing and protection is also for example PVC. It is 0.20 mm thick before lamination and 0.18 mm thick after lamination. This upper layer 220 of finishing and protection comprises a cutout 222 corresponding to a cavity 410. Alternatively, rather than making a cutout 222 in the one or more layers laminated above the antenna support 210, the cavity 410 is milled before connection and fixing of the module 400 in the cavity 410.
    The lower layer 205 and the upper layer 220, as well as the antenna support 210 are not necessarily monolayers. Each of them may possibly consist of one or more layers, all rolled together in the finished card 1. The total thickness of all the layers 205-220, and therefore of the card 1, is substantially 0.8 mm after lamination.
    A module 400, called "single-sided" is produced, for example in known manner, on a substrate 412 comprising conductive tracks 414, 416 on one face (called "contact face" or "front face"), and a electronic chip 418, on the other (called "back face" or "face bonding") (see Figure 3). The fixing of the electronic chip 418 on the substrate 412 is carried out by at least one known technique such as chip fixing ("die-attach" according to the English terminology) and its electrical connection to the conductive tracks 414, 416 is achieved by at least one known technique such as flip-chip technology, wire-bonding, and the like. The chip 418 and its possible connections by wires to the conductive tracks 414, 416 are advantageously protected by encapsulation in a resin 420 ("globe top" or "dam & fill" according to the English terminology, corresponding to a UV or thermal encapsulation) . The chip 418 being placed on the rear face of the substrate 412 or in a cutout made in it, the encapsulation is carried out from this rear face and can form an extra thickness with respect thereto.
    After having placed a connection unit 300 (possibly glued) on or in the support 210, the ends 216, 218 of the antenna 214 are connected (for example by thermocompression) to the first portions 317 of the connection pads 316. This assembly, consisting of the antenna 214 and the connection unit 300 on the support 210, can be covered with a plastic material layer to form a structure that can be sold to be laminated with one or more other layers of plastic material in order to make a smart card 1.
    According to one embodiment of the method according to the invention, the antenna support 210 is laminated between plastic layers (PVC for example) 205, 220 leaving the cavity 410 open in which a module 400 can be housed . Each cavity 410 has dimensions such that the connection pads 316 and, especially, its drops of solder material 350 remain accessible. Alternatively, the upper layer 220 having no cutout 222, the antenna support 210 is laminated between the lower 205 and upper 220 layers completely covering the connection unit 300 (Figure 5), then the cavity 410 in which a module 400 can be housed is milled (Figure 6). According to this embodiment not shown, this milling not only allows to form the cavity 410 so that it accommodates the chip 418 and the encapsulation resin 420, but also to release a portion of each drop of welding material 350, of the plastic material forming the layer or layers laminated on the support 210. Indeed, the milling is performed on at least a portion of the periphery of the welding material 350, to release the solder material 350 laminate 350 layers above the support 210, and in such a way that the solder material 350 exceeds (before heating) above the surface of the cavity 410. Advantageously, when milling the cavity 410, a portion of each drop of weld material 350 is removed, to ensure that the plastic material in which the milling is performed will not prevent or approaching the surfaces to be welded, nor the material forming the drops of weld material 350 molten fusion Thus, for example, the milling is performed circularly around each drop of weld material 350.
    The first portions 317 of the connection pads 316, on which the ends 216, 218 of the antenna 214 have been connected, are outside the countersunk area and remain protected by the upper layer 220. Only the second portions 319 of the pads of FIG. connection 316 covered with the solder material 350 are accessible in the cavity 410 after milling (see Figure 6).
    When the module 400 is in place in the cavity 410, the solder material 350, disposed on each of the second portions 319 of the connection pads 316, is opposite openings in the substrate 412 at which the Conductive tracks 416 are exposed and accessible. The zones of the module 400 found at the drops of solder material 350 are then heated to melt the solder material 350 and solder the connection pads 316 to the conductive tracks 416 (This heating operation is optionally performed at the same time as that consisting in heating zones of heat-reactive adhesive, very close to the drops of solder material for sticking each module in its cavity). It will be noted that the zones of the module 400 which are located at the drops of solder material 350 correspond to conductive areas 416 under which there is no substrate 412. The thermal conduction of the heat supplied by a thermode on the surfaces conductive 416 is optimized. By choosing a solder material 350 having a melting temperature between 120 ° C and 230 ° C, and more preferably between 130 and 150 ° C, it is possible to perform the heating operation of the solder material 230 by applying, with a thermode for example, on an area of the module 400, a temperature between 120 ° C and 250 ° C.
    Because of the thickness of the module 400 and the height of the dome of a drop of weld material 350, when the solder material melts, it wets the corresponding conductive track 416.
    The solder between the connection pads 316 and the conductive tracks 416 can cover an area of the order of 2 mm 2 and is such that a sufficiently high pullout force of the module 400 is obtained to meet the specifications of this type. of product. The solder material 350 thus makes it possible not only to establish an electrical connection between the conductive tracks 416 and the connection pads 316, but also to fix the module 400 in the cavity 410 without the aid of other adhesive.
    权利要求:
    Claims (17)
    [1" id="c-fr-0001]
    claims
    A method of manufacturing a smart card, comprising: - producing an antenna (214) for electromagnetic coupling with a non-contact card reading device, the antenna (214) having at least two ends ( 216, 218), - the lamination of at least two plastic layers between which is placed the antenna (214); placing, in a cavity (410) formed in at least one plastic layer, a chip card module (400) comprising a substrate (412) having first and second main faces, with conductive tracks (414, 416) only on the first main face of the substrate, characterized in that it furthermore comprises the provision of a connection unit (300) comprising a flexible film (310) with a conducting layer (312) on one of its main faces, this conductive layer (312) comprising at least one connection pad (316) having a first (317) and a second (319) portion, electrically connected to each other, - the connection from one end of the antenna (214) to a first portion (317) of the conductive layer (312) of the connection pad (316), and - the connection of a conductive trace (416) of the module (400) located on the first face of the substrate (412) of the module (400), at one the portion (319) of the conductive layer (312) of the connection pad (316).
    [2" id="c-fr-0002]
    The method of claim 1, wherein a solder material (350) is deposited on the second portion (319) of the conductive layer (312) of a bond pad (316) to connect an end (216 or 218) from the antenna (214) to the module (400).
    [3" id="c-fr-0003]
    3. Method according to claim 2, wherein the module (400) is heated once in place in the cavity (410), the solder material (350) deposited on the second portion (319) of the conductive layer (312). ) of the connection pad (316), in order to weld a conductive track (416) of the module (400) dedicated to an antenna connection, with a connection pad (316).
    [4" id="c-fr-0004]
    4. The method of claim 3, wherein the solder material (350) deposited on a connection pad (316) of the antenna (214) exceeds, before heating, the surface of the cavity (410).
    [5" id="c-fr-0005]
    5. The method of claim 3 or 4, wherein the solder material (350) is made of a material having a melting temperature between 120'O and 230'O, and more preferably between 130 and 150 ^.
    [6" id="c-fr-0006]
    6. Method according to one of claims 3 to 5, wherein the heating of the solder material (350) is achieved by applying, on an area of the module (400), a temperature between 120 ^ and 250 ° C.
    [7" id="c-fr-0007]
    7. Method according to one of claims 2 to 6, wherein the deposition of the solder material (350) on the second portion (319) of the conductive layer (312) is achieved by a technique selected from the exemption, screen printing and so-called "wave" technology.
    [8" id="c-fr-0008]
    8. Method according to one of the preceding claims, wherein is deposited in openings in the substrate (412) of the module (400), a solder alloy on the conductive tracks (416) dedicated to the connection with the antenna (214) facing the second portions (319) of the conductive layer (312) of the connection unit (300).
    [9" id="c-fr-0009]
    9. Method according to one of the preceding claims wherein the connection unit (300) is disposed in a cutout formed in a plastic layer (21OB).
    [10" id="c-fr-0010]
    A chip card comprising: an antenna (214) having at least two ends (216, 218); at least two layers of plastic material between which the antenna (214) is placed; a chip card module (400) comprising a substrate (412) having first and second main faces, with conductive tracks (414, 416) on the first face of the substrate (412), the second face of the substrate ( 412) being devoid of conductive tracks, wherein the module (400) is housed in a cavity (410) formed in at least one of the plastic layers, characterized in that it furthermore comprises a connection unit (300) comprising a flexible film (310) with a conductive layer (312) on one of its main faces, said conductive layer (312) having at least one connection pad (316) having a first (317) and a second (319) portions, electrically interconnected, one end of the antenna being electrically connected to a first portion (317) of the conductive layer (312) and a conductive track (416) of the module (400), located on the first face of the substrate (41 2) of the module (400), being electrically connected to a second portion (319) of the conductive layer (312) of the connection pad (316).
    [11" id="c-fr-0011]
    11. Smart card according to claim 10, comprising a connection unit (300) with two connection pads (316), each having a first (317) and a second (319) portions, respectively electrically connected to one end (216 or 218) of the antenna (214) and secondly to a conductive track (416) of the module (400) located on the first face of the substrate (412).
    [12" id="c-fr-0012]
    Antenna carrier for a smart card, with an antenna (214) for electromagnetic coupling with a non-contact card reader, the antenna (214) having at least two ends (216, 218), characterized by it further comprises a connection unit (300) having a flexible film (310) and a conductive layer (312) on one of the main faces of the flexible film (310), said conductive layer (312) comprising at least one connection pad (316) having a first portion (317) and a second portion (319) electrically connected to each other, the first portion (317) being electrically connected to one of the ends (216, 218) of the antenna (214) and - a solder material (350) deposited on the second portion (319) of the conductive layer (312), with a thickness adapted to establish an electrical connection with a conductive track (416) located on a first main face of a su bstrat (412) of a smart card module (400) (1), when the module (400) is positioned in a cavity (410) of the smart card (1), with a second main face, devoid of conducting tracks turned towards the connection unit (300).
    [13" id="c-fr-0013]
    Antenna support according to claim 12, wherein the solder material (350) deposited on the second portion (319) of the conductive layer (312) of the connection unit (300) has a thickness between 0 , 02 and 0.5 mm.
    [14" id="c-fr-0014]
    Antenna support according to one of claims 12 and 13, comprising a plurality of plastic layers laminated together and wherein the connection unit (300) is disposed in a cut-out in at least one of the layers of plastic material.
    [15" id="c-fr-0015]
    Antenna support according to one of claims 12 to 14, wherein the solder material (350) is made of an alloy having a reflow temperature of less than or equal to 2 ° C.
    [16" id="c-fr-0016]
    16. Antenna support according to one of claims 12 to 15, comprising a substrate (210) of PVC.
    [17" id="c-fr-0017]
    17. A method of manufacturing an antenna support according to one of claims 12 to 16, wherein a connection unit (300) is laminated with a layer of plastic material on which an antenna (214).
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    EP3437028B1|2021-11-10|
    EP3437028A1|2019-02-06|
    KR20180124052A|2018-11-20|
    FR3049739B1|2021-03-12|
    引用文献:
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    US5969951A|1997-03-13|1999-10-19|Orga Kartensysteme Gmbh|Method for manufacturing a chip card and chip card manufactured in accordance with said method|
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    EP2221751A1|2009-02-20|2010-08-25|Oberthur Technologies|Support for a chip card, chip card comprising such a support|
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    JP3785083B2|2001-11-07|2006-06-14|株式会社東芝|Semiconductor device, electronic card and pad rearrangement substrate|
    KR100910769B1|2002-06-11|2009-08-04|삼성테크윈 주식회사|IC card and manufacturing method thereof|
    FR2855637B1|2003-05-26|2005-11-18|A S K|METHOD FOR MANUFACTURING CONTACTLESS TICKET AND TICKET OBTAINED THEREBY|
    FR2863747B1|2003-12-11|2006-03-24|Oberthur Card Syst Sa|RELIABILITY OF DUAL INTERFACE CARDS BY GRID CONTINUES|
    US8427374B2|2007-10-26|2013-04-23|Toray Industries, Inc.|Planar antenna and method of manufacturing the same|
    US8933555B2|2009-05-15|2015-01-13|Infineon Technologies Ag|Semiconductor chip package|
    US8870080B2|2010-08-12|2014-10-28|Féinics Amatech Teoranta|RFID antenna modules and methods|
    US9390365B2|2014-04-10|2016-07-12|American Banknote Corporation|Integrated circuit module for a dual-interface smart card|
    CN105530413B|2015-12-01|2019-08-30|宁波舜宇光电信息有限公司|Camera module and its electrical bracket and line conduction method|FR3073307B1|2017-11-08|2021-05-28|Oberthur Technologies|SECURITY DEVICE SUCH AS A CHIP CARD|
    FR3082696B1|2018-06-15|2020-09-11|Linxens Holding|METHOD OF MANUFACTURING A ROLL HOLDER FOR ELECTRONIC COMPONENTS, A CHIP CARD MODULE AND A CHIP CARD, AS WELL AS A HOLDER FOR ELECTRONIC COMPONENTS|
    KR102043101B1|2019-02-20|2019-12-02|비티비엘|Digital credit card with improved usability|
    KR102043102B1|2019-02-20|2019-12-02|비티비엘|Digital credit card with improved durability|
    法律状态:
    2017-02-22| PLFP| Fee payment|Year of fee payment: 2 |
    2017-10-06| PLSC| Publication of the preliminary search report|Effective date: 20171006 |
    2018-02-20| PLFP| Fee payment|Year of fee payment: 3 |
    2020-03-25| PLFP| Fee payment|Year of fee payment: 5 |
    2021-03-19| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1652762A|FR3049739B1|2016-03-30|2016-03-30|METHODS OF MANUFACTURING CHIP CARDS AND ANTENNA BRACKETS FOR CHIP CARDS|FR1652762A| FR3049739B1|2016-03-30|2016-03-30|METHODS OF MANUFACTURING CHIP CARDS AND ANTENNA BRACKETS FOR CHIP CARDS|
    BR112018016242-6A| BR112018016242A2|2016-03-30|2017-03-30|methods of manufacturing chip cards and chip card antenna holders|
    US16/085,042| US10740670B2|2016-03-30|2017-03-30|Methods of fabrication of chip cards and of chip card antenna supports|
    CN201780020503.7A| CN108885709A|2016-03-30|2017-03-30|The method for manufacturing chip card and chip card antenna mounting part|
    KR1020187027617A| KR20180124052A|2016-03-30|2017-03-30|Methods of manufacturing chip cards and chip card antenna supports|
    EP17717484.4A| EP3437028B1|2016-03-30|2017-03-30|Methods of fabrication of chip cards and of chip card antenna supports|
    PCT/FR2017/050735| WO2017168100A1|2016-03-30|2017-03-30|Methods of fabrication of chip cards and of chip card antenna supports|
    JP2018549180A| JP2019511782A|2016-03-30|2017-03-30|Method of manufacturing chip card and method of manufacturing chip card antenna support|
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